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Negative differential resistance in direct bandgap GeSn p-i-n structures

机译:直接带隙GeSn p-i-n结构中的负微分电阻

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摘要

Certain GeSn alloys are group IV direct bandgap semiconductors with prospects for electrical and optoelectronical applications. In this letter, we report on the temperature dependence of the electrical characteristics of high Sn-content Ge0.89Sn0.11 p-i-n diodes. NiGeSn contacts were used to minimize the access resistance and ensure compatibility with silicon technology. The major emphasis is placed on the negative differential resistance in which peak to valley current ratios up to 2.3 were obtained. TCAD simulations were performed to identify the origin of the various current contributions, providing evidence for direct band to band tunneling and trap assisted tunneling.
机译:某些GeSn合金是IV组直接带隙半导体,具有电气和光电应用前景。在这封信中,我们报告了高锡含量Ge0.89Sn0.11 p-i-n二极管的电气特性与温度的关系。 NiGeSn触点用于最小化访问电阻并确保与硅技术的兼容性。主要重点放在负差分电阻上,在该电阻中获得了高达2.3的峰谷电流比。进行了TCAD仿真,以识别各种电流贡献的来源,为直接带对带隧穿和陷阱辅助隧穿提供证据。

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